Net Weight 30 Grams Syringe with Bag Packaging Gray GD900 Thermal Conductive Grease Paste Silicone Compound Heat Sink Cooler BX30 (GD900-BX30*1 Piece)

★★★★★ 4.8 48 reviews

US$6.40
Price when purchased online
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US$6.40
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Product details

Management number 239454552 Release Date 2026/07/14 List Price US$6.40 Model Number 239454552
Category
  • [EXCELLENT THERMAL CONDUCTIVITY]: GD900 thermal paste conductivity is 4.8 W/m-k. It ensures that the heat generated by the CPU or GPU is effectively dissipated. It has excellent temperature reduction performance.
  • [SAFETY APPLICATION]: The practical syringe ensures effortless application of thermal paste exactly where it needs to be. Perfect for CPU, cooling, GPU, LEDs, and heat sink fins.
  • [NON-CONDUCTIVE]: It is also not electrically conductive : there is no risk of short-circuits and safe to use with all types of heatsinks.
  • [ASSISTING TOOLS]: We provide tools including wet wipe, finger cots and a scraper to help you remove original thermal compound and apply our paste comfortably.
  • [EASY TO USE]: Convenient for application and storage. the paste is not stiff and comes with a scraper, the moderate viscosity can be easily smeared evenly, so that all beginners can easily apply it.
UPC 700600860027
ASIN B07ZT9NMJD
Material Silicone
Item Form Paste
Viscosity 0w
Brand Name Generic
Unit Count 1.0 Count
Item Weight 82 Grams
Part Number GD900
Manufacturer Foshan High Conductivity Electronics Co., Ltd.
Model Number GD900-BX30*1
Liquid Volume 1.7 Milliliters
Container Type Syringe
Number of Items 1
SAE J300 Viscosity Grade 0W
Upper Temperature Rating 392 Degrees Fahrenheit
Specific Uses For Product Cooling Electronic Components
Recommended Uses For Product Electrical
EU Spare Part Availability Duration 8 Years

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4.8 out of 5
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48 ratings | 20 reviews
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